EE Teaching Labs

User Tools

Site Tools

You are here: EECS Teaching Labs » BRG310C - Analog Support Lab
Trace:
brg310c

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
Next revision		Previous revision
brg310c [2019/04/30 22:42] – aminbrg310c [2020/07/04 05:44] (current) – amin
Line 14: Line 14:
  
   * FINETECH LAMBDA DIE BONDER   * FINETECH LAMBDA DIE BONDER
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0001.MOV|Part-1]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0001.MOV|Part-1]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0002.MOV|Part-2]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0002.MOV|Part-2]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0003.wmv|Part-3]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0003.wmv|Part-3]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0004.MOV|Part-4]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0004.MOV|Part-4]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0005.MOV|Part-5]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0005.MOV|Part-5]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0006.MOV|Part-6]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0006.MOV|Part-6]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0007.MOV|Part-7]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0007.MOV|Part-7]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0008.MOV|Part-8]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0008.MOV|Part-8]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_0009.MOV|Part-9]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0009.MOV|Part-9]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_00010.MOV|Part-10]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0010.MOV|Part-10]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_00011.MOV|Part-11]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0011.MOV|Part-11]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_00012.MOV|Part-12]] +    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0012.MOV|Part-12]] 
-    * [[https://www.eecs.yorku.ca/ee/EECS_TRAINING/FINETECH_LAMBDA_DIE_BONDER/MVI_00013.MOV|Part-13]]+    * [[https://www.eecs.yorku.ca/ee/BERGERON_LABS/ELECTRONICS/TRAINING_ELECTRONICS/FINETECH_LAMBDA_DIE_BONDER/MVI_0013.MOV|Part-13]]
  
  
  
brg310c.1556664154.txt.gz · Last modified: by amin