This facility is a controlled environment designed to maintain very low levels of particulates such as dust, airborne organisms, or vaporized particles.

The clean Room supports the processing of photolithography, microfluidics, micro-optic, and sensor devices as well as surface cleaning, bonding and etching throughout Oxygen plasma. Advanced processing capabilities include soft lithography techniques for patterning elastomeric materials.

• Clean Room Floor plan

• Dilase 250 - Direct Laser Lithography System

• Zepto Plasma Surface Technology - Diener Electronic

• WS-650 Series Spin Coater - Laurell Technologies Corporation

• UV-KUB UV LED - Masking System